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Kester Silver Solder
- 96.5 percent Tin (Sn)
- 3.0 percent Silver (AG)
- 0.5 percent Copper (Cu)
- Flux Cored Wire
- Lead free (RoHS Compliant)
- No-Clean Flux
- 0.031" diameter (8mm)
- 60 gram
Manufacturer Data
Kester “275” No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of “275” No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester “275” was also designed to reduce spattering common to most core fluxes. Kester “275” No-Clean Flux is classified as Type ROL0 flux under IPC ANSI/J-STD-004 Joint Industry Standard.
Performance Characteristics
- Colorless translucent residues
- Improves wetting performance
- Excellent solderability and fast wetting to a variety of surface finishes
- Eliminates the need and expense of cleaning
- Low smoke
- Low odor
- Low spattering
- Compatible with leaded and lead-free alloys
- Classified as ROL0 per J-STD-004
- Compliant to Bellcore GR-78
Note from Madisound
When it became necesarry to change to Lead-Free solder in order to comply with new European environmental standards (RoHS), we set out to find a replacement to the lead based solder we were using. The difficulty in tin based solders is a higher melting point, spattering and poor flow. After sampling many different solders and wire diameters, we found this Kester 275 solder as the most acceptable. We have not done listening tests to see how it compares to say a 4% silver solder, but if you send us a bottle of Scotch and and a case of beer, we'll explore the issue for you.
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